View MA4FCP200_4748493.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MA4FCP200
Flip Chip PIN Diode
Features
Low Series Resistance Low Capacitance Fast Switching Speed Silicon Nitride Passivation Polymer Scratch Protection RoHS Compliant Rev. V3
1264 Outline
Description
M/A-COM Technology Solutions MA4FCP200 is a silicon flip chip PIN diode fabricated using a patented HMIC process which provides for repeatable electrical characteristics. This diode is fabricated on epitaxial wafers using a process designed for extremely low parasitics. The diode is fully passivated with silicon nitride to minimize leakage current. The chip also has an additional polymer layer for impact and scratch protection to prevent damage to the active area during handling.
Applications
The small outline and low 0.05pS RC product, make the device useful in multi-throw switches and switched phase shifter circuits requiring <20nS switching speeds at operating frequencies up to 18GHz. * Backside metal contacts: 0.1M thick gold. * Yellow hatched areas indicate backside, mounting,
ohmic, gold contacts.
Absolute Maximum Ratings1
TAMB = +25C (unless otherwise specified)
Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Dissipated Power Mounting Temperature Absolute Maximum 100mA - 70V - 55C to + 125C - 55C to + 150C 100mW +300C for 10 seconds
Inches Dim. Min.
A B C D E F G 0.014 0.008 0.004 0.003 0.002 0.008 0.004
Millimeters Max. Min.
0.356 0.203 0.102 0.076 0.175 0.203 0.102
Max.
0.381 0.229 0.127 0.102 0.225 0.254 0.152
0.015 0.009 0.005 0.004 0.003 0.010 0.006
1. Exceeding any of these limits may cause permanent damage to the chip.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MA4FCP200
Flip Chip PIN Diode
Electrical Specifications @ TAMB +25C
Parameters @ Conditions Total Capacitance @ -40V, 1MHz1 Total Capacitance @ -40V, 1GHz
2,3 2,3 1,3
Rev. V3
Symbol CT CT RS RS VF VR IR TL
Units pF pF V V
A
Min. ---- ---- ---- ---- ---- 50 ---- ---- ----
Typ. 0.025 0.020 2.4 2.8 1.25 ---- ---- 100 900
Max. 0.030 ---- 3.0 ---- 1.5 ---- 10 ---- ----
Series Resistance @ +50mA , 100MHz Series Resistance @ +50mA , 1GHz Forward Voltage @ +100mA Reverse Voltage @ -10A Reverse Current @ -50V Lifetime @ IF = +10mA / IREV = -6mA Steady State Thermal Resistance4
nS C/W
1. Total capacitance is equivalent to the sum of junction capacitance, Cj, plus the die parasitic capacitance, Cp. 2. The series resistance, RS, is equal to the total diode resistance which also includes the resistance of the junction, Rj. 3. Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package. 4. Steady-state Thermal Resistance measured with die mounted in an ODS-186 package.
186
ESD
These devices very susceptible to ESD and are rated Class 0 (0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF 10%, R = 1.5kW 1%]. Even though tested die pass 100V ESD, they must be handled in a static-free environment.
Specifications Subject to Change Without Notice. 2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MA4FCP200
Flip Chip PIN Diode
Typical Performance @ TAMB +25C
MA4FCP200 Rs vs I
1000.0
Rs_50 MHz Rs_100 MHz Rs_500 MHz
Rev. V3
100.0
Rs ( Ohm ) s
10.0 1.0 0.01
0.10
1.00
10.00
100.00
I ( mA )
MA4FCP200 Rs vs Frequency
5
10mA
4
50mA
Rs ( Ohms ) 3
2
100mA
1
0 0 200 400 F ( MHz )
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
600
800
1000
MA4FCP200
Flip Chip PIN Diode
Rev. V3
Typical Performance @ TAMB +25C
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MA4FCP200
Flip Chip PIN Diode
Rev. V3
MA4FCP200 SPICE Model PinDiodeModel NLPINM1 Is=1.0E-14 A wBv= 70 V Vi=0.0 V wPmax= 100 mW Un= 900 cm^2/V-sec Ffe= 1.0 Wi= 5.0 um Rr= 10 K Ohms Cjmin= 0.02 pF Tau= 0.10 usec Rs(I)= Rc + Rj(I) = 0.05 Ohm + Rj(I) Cj0= 0.03 pF Vj= 0.7 V M= 0.5 Fc= 0.5 Imax= 1.0 E+5 A/m^2 Kf=0.0 Af=1.0
Rs
Ls = 0.6nH
_
+
Ct
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.
MA4FCP200
Flip Chip PIN Diode
Rev. V3
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding Techniques
These devices were designed for insertion onto hard or soft substrates with the junction side down. They can be mounted with electrically conductive epoxy or with a eutectic solder preform. However, tin rich solders will scavenge gold from the bottom contacts and are not recommended. Indalloy or 80/20, Au/Sn, solders are acceptable. Maximum soldering temperature must be <300C for <10 sec. These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be mounted onto silkscreened circuits using electrically conductive Ag epoxy, approximately 1-2 mils in thickness and cured at approximately 90C to 150C per manufacturer's schedule. For extended cure times, >30 minutes, temperatures must be kept below 200C. The die can also be assembled using non conductive epoxy with the junction side up, and wire or ribbon bonds made to the pads.
Circuit Mounting Dimensions ( Inches )
0.013"
0.012" (2) PL
0.008" (2) PL
Ordering Information
Part Number MA4FCP200 MA4FCP200-W
6
Packaging Die in Gel Pack Wafer Cut on Tape
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 * Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, * India Tel: +91.80.43537383 * China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.

▲Up To Search▲

Price & Availability of MA4FCP200

	To Download MA4FCP200 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .